(a) Does the C2F6 flow rate affect the wafer-to-wafer variability in etch uniformity? Use = 0.05. (b) Draw box plots to assist in the interpretation of the data from this experiment
(a) Does the C2F6 flow rate affect the wafer-to-wafer variability in etch uniformity? Use = 0.05. (b) Draw box plots to assist in the interpretation of the data from this experiment
Chemistry
10th Edition
ISBN:9781305957404
Author:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
Publisher:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
Chapter1: Chemical Foundations
Section: Chapter Questions
Problem 1RQ: Define and explain the differences between the following terms. a. law and theory b. theory and...
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An article in Solid State Technology, "Orthogonal Design of Process Optimization and Its Application to Plasma Etching" by G.Z. Yin and D.W. Jillie (May, 1987) describes an experiment to determine the effect of C2F6 flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing. Data for two flow rates are as follows:
C2F6 |
Uniformity Observation |
|||||
(SCCM) |
1 |
2 |
3 |
4 |
5 |
6 |
125 |
2.7 |
4.6 |
2.6 |
3.0 |
3.2 |
3.8 |
200 |
4.6 |
3.4 |
2.9 |
3.5 |
4.1 |
5.1 |
(a) Does the C2F6 flow rate affect the wafer-to-wafer variability in etch uniformity? Use = 0.05.
(b) Draw box plots to assist in the interpretation of the data from this experiment
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