A 0.3-cm-thick, 12-cm-high, and 18-cm-longcircuit board houses 80 closely spaced logic chips on oneside, each dissipating 0.04 W. The board is impregnated withcopper fillings and has an effective thermal conductivity of30 W/m·K. All the heat generated in the chips is conductedacross the circuit board and is dissipated from the back sideof the board to a medium at 40°C, with a heat transfer coefficientof 40 W/m2·K. (a) Determine the temperatures on thetwo sides of the circuit board. (b) Now a 0.2-cm-thick, 12-cmhigh,and 18-cm-long aluminum plate (k = 237 W/m·K)with 864 2-cm-long aluminum pin fins of diameter 0.25 cm isattached to the back side of the circuit board with a 0.02-cmthickepoxy adhesive (k = 1.8 W/m·K). Determine the newtemperatures on the two sides of the circuit board.
A 0.3-cm-thick, 12-cm-high, and 18-cm-long
circuit board houses 80 closely spaced logic chips on one
side, each dissipating 0.04 W. The board is impregnated with
copper fillings and has an effective thermal conductivity of
30 W/m·K. All the heat generated in the chips is conducted
across the circuit board and is dissipated from the back side
of the board to a medium at 40°C, with a heat transfer coefficient
of 40 W/m2·K. (a) Determine the temperatures on the
two sides of the circuit board. (b) Now a 0.2-cm-thick, 12-cmhigh,
and 18-cm-long aluminum plate (k = 237 W/m·K)
with 864 2-cm-long aluminum pin fins of diameter 0.25 cm is
attached to the back side of the circuit board with a 0.02-cmthick
epoxy adhesive (k = 1.8 W/m·K). Determine the new
temperatures on the two sides of the circuit board.
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