8.52 Pull-strength tests on 10 soldered leads for a semiconductor device yield the following results, in pounds of force required to rupture the bond: 19.8 12.7 13.2 16.9 10.6 12.5 18.8 11.1 14.3 17.0 Another set of 8 leads was tested after encapsulation to determine whether the pull strength had been in- creased by encapsulation of the device, with the fol- lowing results: 24.9 22.8 23.6 22.1 20.4 21.6 21.8 22.5 Comment on the evidence available concerning equal- ity of the two population variances.

A First Course in Probability (10th Edition)
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8.52 Pull-strength tests on 10 soldered leads for a
semiconductor device yield the following results, in
pounds of force required to rupture the bond:
19.8 12.7
13.2 16.9 10.6
12.5
18.8 11.1 14.3 17.0
Another set of 8 leads was tested after encapsulation
to determine whether the pull strength had been in-
creased by encapsulation of the device, with the fol-
lowing results:
24.9 22.8 23.6 22.1 20.4 21.6 21.8 22.5
Comment on the evidence available concerning equal-
ity of the two population variances.
Transcribed Image Text:8.52 Pull-strength tests on 10 soldered leads for a semiconductor device yield the following results, in pounds of force required to rupture the bond: 19.8 12.7 13.2 16.9 10.6 12.5 18.8 11.1 14.3 17.0 Another set of 8 leads was tested after encapsulation to determine whether the pull strength had been in- creased by encapsulation of the device, with the fol- lowing results: 24.9 22.8 23.6 22.1 20.4 21.6 21.8 22.5 Comment on the evidence available concerning equal- ity of the two population variances.
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