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6. In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux q"o (W/m²), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T, while the free surface of the film is exposed to air at O and a convection heat transfer coefficient h L- 0.25 mm k- 0.025 WimK L-1.0 mm Bond, To k,-0.05 WimeK Film Substrate a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. b) Assume the following conditions: D = 20°C, h 50 W/m2. K, and T1= 30°C. Calculate the heat flux q", that is required to maintain the bonded surface at To = 60°C

6. In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux q"o (W/m²), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T, while the free surface of the film is exposed to air at O and a convection heat transfer coefficient h L- 0.25 mm k- 0.025 WimK L-1.0 mm Bond, To k,-0.05 WimeK Film Substrate a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. b) Assume the following conditions: D = 20°C, h 50 W/m2. K, and T1= 30°C. Calculate the heat flux q", that is required to maintain the bonded surface at To = 60°C

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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6. In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux q". (W/m2), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at O and a convection heat transfer coefficient h Air L= 0.25 mm k = 0.025 Wim-K L,- 1.0 mm Bond, To k = 0.05 W/m-K Film Substrate a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. b) Assume the following conditions: D = 20°C, h = 50 W/m2. K, and T1= 30°C. Calculate the heat flux q", that is required to maintain the bonded surface at To= 60°C
Transcribed Image Text:6. In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux q". (W/m2), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at O and a convection heat transfer coefficient h Air L= 0.25 mm k = 0.025 Wim-K L,- 1.0 mm Bond, To k = 0.05 W/m-K Film Substrate a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. b) Assume the following conditions: D = 20°C, h = 50 W/m2. K, and T1= 30°C. Calculate the heat flux q", that is required to maintain the bonded surface at To= 60°C
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