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4. An aluminum heat sink (k = 240 W/m K), used to cool an array of electronic chips, consists of a square channel of inner width w = 25 mm, through which liquid flow may be assumed to maintain a uniform surface temperature of T₁ = 20°C. The outer width and length of the channel are W = 40 mm and L = 160 mm, respectively. Chip, Te Heat sink T₁ Coolant -W- Rt.c -T₂ If N = 120 chips attached to the outer surfaces of the heat sink maintain an approximately uniform surface temperature of T₂ = 50°C and all of the heat dissipatec by the chips is assumed to be transferred to the coolant what is the heat dissipation per chip? If the contact resis tance between each chip and the heat sink is Ruc opnun 0.2 K/W, what is the chip temperature?

4. An aluminum heat sink (k = 240 W/m K), used to cool an array of electronic chips, consists of a square channel of inner width w = 25 mm, through which liquid flow may be assumed to maintain a uniform surface temperature of T₁ = 20°C. The outer width and length of the channel are W = 40 mm and L = 160 mm, respectively. Chip, Te Heat sink T₁ Coolant -W- Rt.c -T₂ If N = 120 chips attached to the outer surfaces of the heat sink maintain an approximately uniform surface temperature of T₂ = 50°C and all of the heat dissipatec by the chips is assumed to be transferred to the coolant what is the heat dissipation per chip? If the contact resis tance between each chip and the heat sink is Ruc opnun 0.2 K/W, what is the chip temperature?

Introduction to Chemical Engineering Thermodynamics
Introduction to Chemical Engineering Thermodynamics
8th Edition
ISBN:9781259696527
Author:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Chapter1: Introduction
Section: Chapter Questions
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4. An aluminum heat sink (k = 240 W/m K), used to cool an array of electronic chips, consists of a square channel of inner width w = 25 mm, through which liquid flow may be assumed to maintain a uniform surface = 20°C. The outer width and length temperature of T₁ of the channel are W = 40 mm and L = 160 mm, respectively. Chip, Tc- Heat sink T₁ Coolant -W- -W- -Rt.c -T₂ If N = 120 chips attached to the outer surfaces of the heat sink maintain an approximately uniform surface temperature of T₂ = 50°C and all of the heat dissipated by the chips is assumed to be transferred to the coolant, what is the heat dissipation per chip? If the contact resis- tance between each chip and the heat sink is Ruc 0.2 K/W, what is the chip temperature? =
Transcribed Image Text:4. An aluminum heat sink (k = 240 W/m K), used to cool an array of electronic chips, consists of a square channel of inner width w = 25 mm, through which liquid flow may be assumed to maintain a uniform surface = 20°C. The outer width and length temperature of T₁ of the channel are W = 40 mm and L = 160 mm, respectively. Chip, Tc- Heat sink T₁ Coolant -W- -W- -Rt.c -T₂ If N = 120 chips attached to the outer surfaces of the heat sink maintain an approximately uniform surface temperature of T₂ = 50°C and all of the heat dissipated by the chips is assumed to be transferred to the coolant, what is the heat dissipation per chip? If the contact resis- tance between each chip and the heat sink is Ruc 0.2 K/W, what is the chip temperature? =
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