Homework Help is Here – Start Your Trial Now!
Engineering
Chemical Engineering
4. An aluminum heat sink (k = 240 W/m K), used to cool an array of electronic chips, consists of a square channel of inner width w = 25 mm, through which liquid flow may be assumed to maintain a uniform surface temperature of T₁ = 20°C. The outer width and length of the channel are W = 40 mm and L = 160 mm, respectively. Chip, Te Heat sink T₁ Coolant -W- Rt.c -T₂ If N = 120 chips attached to the outer surfaces of the heat sink maintain an approximately uniform surface temperature of T₂ = 50°C and all of the heat dissipatec by the chips is assumed to be transferred to the coolant what is the heat dissipation per chip? If the contact resis tance between each chip and the heat sink is Ruc opnun 0.2 K/W, what is the chip temperature?

4. An aluminum heat sink (k = 240 W/m K), used to cool an array of electronic chips, consists of a square channel of inner width w = 25 mm, through which liquid flow may be assumed to maintain a uniform surface temperature of T₁ = 20°C. The outer width and length of the channel are W = 40 mm and L = 160 mm, respectively. Chip, Te Heat sink T₁ Coolant -W- Rt.c -T₂ If N = 120 chips attached to the outer surfaces of the heat sink maintain an approximately uniform surface temperature of T₂ = 50°C and all of the heat dissipatec by the chips is assumed to be transferred to the coolant what is the heat dissipation per chip? If the contact resis tance between each chip and the heat sink is Ruc opnun 0.2 K/W, what is the chip temperature?

Introduction to Chemical Engineering Thermodynamics
Introduction to Chemical Engineering Thermodynamics
8th Edition
ISBN:9781259696527
Author:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Chapter1: Introduction
Section: Chapter Questions
Problem 1.1P
See similar textbooks
icon
Related questions
Question
4. An aluminum heat sink (k = 240 W/m K), used to cool an array of electronic chips, consists of a square channel of inner width w = 25 mm, through which liquid flow may be assumed to maintain a uniform surface = 20°C. The outer width and length temperature of T₁ of the channel are W = 40 mm and L = 160 mm, respectively. Chip, Tc- Heat sink T₁ Coolant -W- -W- -Rt.c -T₂ If N = 120 chips attached to the outer surfaces of the heat sink maintain an approximately uniform surface temperature of T₂ = 50°C and all of the heat dissipated by the chips is assumed to be transferred to the coolant, what is the heat dissipation per chip? If the contact resis- tance between each chip and the heat sink is Ruc 0.2 K/W, what is the chip temperature? =
Transcribed Image Text:4. An aluminum heat sink (k = 240 W/m K), used to cool an array of electronic chips, consists of a square channel of inner width w = 25 mm, through which liquid flow may be assumed to maintain a uniform surface = 20°C. The outer width and length temperature of T₁ of the channel are W = 40 mm and L = 160 mm, respectively. Chip, Tc- Heat sink T₁ Coolant -W- -W- -Rt.c -T₂ If N = 120 chips attached to the outer surfaces of the heat sink maintain an approximately uniform surface temperature of T₂ = 50°C and all of the heat dissipated by the chips is assumed to be transferred to the coolant, what is the heat dissipation per chip? If the contact resis- tance between each chip and the heat sink is Ruc 0.2 K/W, what is the chip temperature? =
Expert Solution
trending now

Trending now

This is a popular solution!

steps

Step by step

Solved in 3 steps with 9 images

SEE SOLUTIONCheck out a sample Q&A here
Blurred answer
Recommended textbooks for you
Introduction to Chemical Engineering Thermodynami…
Introduction to Chemical Engineering Thermodynami…
Chemical Engineering
ISBN:
9781259696527
Author:
J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:
McGraw-Hill Education
Elementary Principles of Chemical Processes, Bind…
Elementary Principles of Chemical Processes, Bind…
Chemical Engineering
ISBN:
9781118431221
Author:
Richard M. Felder, Ronald W. Rousseau, Lisa G. Bullard
Publisher:
WILEY
Elements of Chemical Reaction Engineering (5th Ed…
Elements of Chemical Reaction Engineering (5th Ed…
Chemical Engineering
ISBN:
9780133887518
Author:
H. Scott Fogler
Publisher:
Prentice Hall
Process Dynamics and Control, 4e
Process Dynamics and Control, 4e
Chemical Engineering
ISBN:
9781119285915
Author:
Seborg
Publisher:
WILEY
Industrial Plastics: Theory and Applications
Industrial Plastics: Theory and Applications
Chemical Engineering
ISBN:
9781285061238
Author:
Lokensgard, Erik
Publisher:
Delmar Cengage Learning
Unit Operations of Chemical Engineering
Unit Operations of Chemical Engineering
Chemical Engineering
ISBN:
9780072848236
Author:
Warren McCabe, Julian C. Smith, Peter Harriott
Publisher:
McGraw-Hill Companies, The
SEE MORE TEXTBOOKS