2. Electrical components often failure due to thermal overload. It follows that thermal analysis of electrical components is critical to their longevity. Consider a silicon chip which is sitting atop a ceramic substrate with 35 mm2 of exposed surface area. Operating at steady state, the chip can pull up to 120 mW of power. The chip surface is cooled by convection from flowing air at 20°C. The heat transfer from the chip to the air is given by Q = hA(T, – T,) where h is the thermal convection coefficient, A is the exposed surface area, and Tb and Tr are absolute temperatures of the body and coolant fluid, respectively. h of the flowing air is found to be 250 W/(m2-K). Assuming heat transfer to the substrate is negligible compared to convection, determine: a. the heat transfer occurring at steady state (W) b. the temperature at the outer surface of the chip (C)

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Chapter2: Steady Heat Conduction
Section: Chapter Questions
Problem 2.30P: 2.30 An electrical heater capable of generating 10,000 W is to be designed. The heating element is...
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2. Electrical components often failure due to thermal overload. It follows that thermal analysis of
electrical components is critical to their longevity. Consider a silicon chip which is sitting atop a
ceramic substrate with 35 mm2 of exposed surface area. Operating at steady state, the chip can
pull up to 120 mW of power. The chip surface is cooled by convection from flowing air at 20°C.
The heat transfer from the chip to the air is given by
Q = hA(T, – T)
where h is the thermal convection coefficient, A is the exposed surface area, and Tb and Tr are
absolute temperatures of the body and coolant fluid, respectively. h of the flowing air is found
to be 250 W/(m2-K). Assuming heat transfer to the substrate is negligible compared to
convection, determine:
the heat transfer occurring at steady state (W)
the temperature at the outer surface of the chip ("C)
a.
b.
Transcribed Image Text:2. Electrical components often failure due to thermal overload. It follows that thermal analysis of electrical components is critical to their longevity. Consider a silicon chip which is sitting atop a ceramic substrate with 35 mm2 of exposed surface area. Operating at steady state, the chip can pull up to 120 mW of power. The chip surface is cooled by convection from flowing air at 20°C. The heat transfer from the chip to the air is given by Q = hA(T, – T) where h is the thermal convection coefficient, A is the exposed surface area, and Tb and Tr are absolute temperatures of the body and coolant fluid, respectively. h of the flowing air is found to be 250 W/(m2-K). Assuming heat transfer to the substrate is negligible compared to convection, determine: the heat transfer occurring at steady state (W) the temperature at the outer surface of the chip ("C) a. b.
Expert Solution
Step 1

a) In steady state condition

Qin = Qout   = 0.12 W

b) Tb = 33.71 deg C

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