Just letters pls 1. What is the most common photoresist used in ICphotolithography? ( )a.negative photoresistb.positive i-line photoresistc.negative i-line photoresistd.high speed color chrome2. Which of the following is not a commonproduction tool in the thin films area? ( )a.plasma resist stripperb.CVD systemsc. PVD systemsd.rapid thermal anneal systeme.sputtering systemf.spin-on-glass dispense system3.The purpose of hard bake is to ( )a.evaporate any residual solventb.harden the resistc.improve resist adhesion to the substrated.all of the above4.The purpose of the contanct formation process isto ()a.insulate all exposed silicon areas of the wafer.b.form metal contacts on all active areas of thesilicon.c.create barriers for charge carriers betweentransistorsd.form metal contacts on all exposed areas ofsilicon dioxide.5.What is the purpose of photolithography? ()a.to etch a permanent pattern into the waferb.to transfer the image of a circuit pattern directlyonto a resist-coated waferc.to create a bottleneck in the wafer process flowd.to implant ions into selected areas of the wafer6. What is the purpose of the etch process?a. To coat the wafer with photoresist and thendevelop the resist after exposureb.To diffuse dopant into the silicon throughopenings in photoresist.c. To produce a termporary pattern on the wafer inareas not protected by photoresistd.To selectively remove material from areas notprotected by photoresist.

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1. What is the most common photoresist used in IC photolithography? ( ) a.negative photoresist b.positive i-line photoresist c.negative i-line photoresist d.high speed color chrome 2. Which of the following is not a common production tool in the thin films area? ( ) a.plasma resist stripper b.CVD systems c. PVD systems d.rapid thermal anneal system e.sputtering system f.spin-on-glass dispense system 3.The purpose of hard bake is to ( ) a.evaporate any residual solvent b.harden the resist c.improve resist adhesion to the substrate d.all of the above

1. What is the most common photoresist used in IC photolithography? ( ) a.negative photoresist b.positive i-line photoresist c.negative i-line photoresist d.high speed color chrome 2. Which of the following is not a common production tool in the thin films area? ( ) a.plasma resist stripper b.CVD systems c. PVD systems d.rapid thermal anneal system e.sputtering system f.spin-on-glass dispense system 3.The purpose of hard bake is to ( ) a.evaporate any residual solvent b.harden the resist c.improve resist adhesion to the substrate d.all of the above

Introductory Circuit Analysis (13th Edition)

13th Edition

ISBN:9780133923605

Author:Robert L. Boylestad

Publisher:Robert L. Boylestad

Chapter1: Introduction

Section: Chapter Questions

Problem 1P: Visit your local library (at school or home) and describe the extent to which it provides literature...

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