The magnetic field at point P in the diagram.

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1. What are the key steps involved in the fabrication of a semiconductor device. 2. You are hired by a chip manufacturing company, and you are asked to prepare a silicon wafer with the pattern below. Describe the process you would use. High Aspect Ratio Trenches Undoped Si Wafer P-doped Si 3. You would like to deposit material within a high aspect ratio trench. What approach would you use and why? 4. A person is setting up a small clean room space to carry out an outreach activity to educate high school students about patterning using photolithography. They obtained a positive photoresist, a used spin coater, a high energy light lamp for exposure and ordered a plastic transparency mask with a pattern on it to reduce cost. Upon trying this set up multiple times they find that the full resist gets developed, and they are unable to transfer the pattern onto the resist. Help them troubleshoot and find out why pattern of transfer has not been successful. 5. You are given a composite…

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Chapter 29, Problem 34AP

To determine

The magnetic field at point P in the diagram.

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