When I do MD simulation on Au32 with initial temperature 300K and 10ps total time duration, most of the bonds has been broken. I would like to know if it is normal
When I do MD simulation on Au32 with initial temperature 300K and 10ps total time duration, most of the bonds has been broken. I would like to know if it is normal
Chapter4: Processor Technology And Architecture
Section: Chapter Questions
Problem 3VE
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When I do MD simulation on Au32 with initial temperature 300K and 10ps total time duration, most of the bonds has been broken. I would like to know if it is normal
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