Two silicon wafer sizes are to be compared: a 6.0-in wafer with a processable area = 5.85-in diameter circle and a 12.0-in wafer with a processable area = 11.75-in diameter circle. The IC chips in both cases are square with 0.50 in on a side. Assume that the cut lines (streets) between chips are of negligible width. What is the percent increase in (a) processable area on the wafer, and (b) number of chips on the wafer compared to the 200% increase in wafer diameter?
Two silicon wafer sizes are to be compared: a 6.0-in wafer with a processable area = 5.85-in diameter circle and a 12.0-in wafer with a processable area = 11.75-in diameter circle. The IC chips in both cases are square with 0.50 in on a side. Assume that the cut lines (streets) between chips are of negligible width. What is the percent increase in (a) processable area on the wafer, and (b) number of chips on the wafer compared to the 200% increase in wafer diameter?
Chapter2: Loads On Structures
Section: Chapter Questions
Problem 1P
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Two silicon wafer sizes are to be compared: a 6.0-in wafer with a processable area = 5.85-in diameter circle and a 12.0-in wafer with a processable area = 11.75-in diameter circle. The IC chips in both cases are square with 0.50 in on a side. Assume that the cut lines (streets) between chips are of negligible width. What is the percent increase in (a) processable area on the wafer, and (b) number of chips on the wafer compared to the 200% increase in wafer diameter?
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