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for
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cohere Vis measure ol in Volts f I 's moesured in
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the current thaugh The G K-ohm 6/the veltage the on the q pmicro copauter on c)The charge
A power diode used in a cell phone tower power supply dissipating power during the conductionprocess requires its junction temperature on not to exceed 180 degrees C. The power diode data sheet givesconduction-state voltage drop of 1.8V and for the DO-4 diode case, the junction-to-case thermal resistance, R-theta , jcis 0.8 degrees C/W. The diode is mounted over a heat sink having thermal resistances, case-to-sink R-theta,cs = 0.3degrees C/W and sink-to-ambient R-theta, sa= 0.6degrees C/W. Calculate the maximum current that diode can withstand safely without overheating if theambient temperature is 30 degrees C. Calculate the difference of temperature from case to sink. If the design requires to limit the junction temperature to 150 degrees C, select a value of R-theta,sa for aheat sink which should be used.