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Summarize examples 1.1 by determining the statement of the problem, objectives, choice of the response, variable, factors, design process. thank you

Summarize examples 1.1 by determining the statement of the problem, objectives, choice of the response, variable, factors, design process. thank you

Practical Management Science
Practical Management Science
6th Edition
ISBN:9781337406659
Author:WINSTON, Wayne L.
Publisher:WINSTON, Wayne L.
Chapter2: Introduction To Spreadsheet Modeling
Section: Chapter Questions
Problem 20P: Julie James is opening a lemonade stand. She believes the fixed cost per week of running the stand...
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Summarize examples 1.1 by determining the statement of the problem, objectives, choice of the response, variable, factors, design process.

thank you

3. Layout of the components on the board 4. Operator 5. Production rate. A flow solder machine is used in the manufacturing process for printed circuit boards. The machine cleans the boards in a flux, preheats the boards, and then moves them along a conveyor through a wave of molten solder. This solder process makes the electrical and mechanical connections for the leaded components on the board. The process currently operates around the I percent defec- tive level. That is, about I percent of the solder joints on a board are defective and require manual retouching. However, because the average printed circuit board contains over 2000 solder joints, even a l percent defective level results in far too many solder joints requiring rework. The process engineer responsible for this area would like to use a designed experi- ment to determine which machine parameters are influential in the occurrence of solder defects and which adjustments should be made to those variables to reduce solder defects. In this situation, engineers are interested in character- izing the flow solder machine; that is, they want to deter- mine which factors (both controllable and uncontrollable) affect the occurrence of defects on the printed circuit boards. To accomplish this, they can design an experiment that will enable them to estimate the magnitude and direc- tion of the factor effects; that is, how much does the response variable (defects per unit) change when each fac- tor is changed, and does changing the factors together produce different results than are obtained from individual factor adjustments-that is, do the factors interact? Sometimes we call an experiment such as this a screening experiment. Typically, screening or characterization exper- iments involve using fractional factorial designs, such as in the golf example in Figure 1.8. The information from this screening or characterization experiment will be used to identify the critical process fac- tors and to determine the direction of adjustment for these factors to reduce further the number of defects per unit. The experiment may also provide information about which fac- tors should be more carefully controlled during routine man- ufacturing to prevent high defect levels and erratic process performance. Thus, one result of the experiment could be the application of techniques such as control charts to one or more process variables (such as solder temperature), in addition to control charts on process output. Over time, if the process is improved enough, it may be possible to base most of the process control plan on controlling process input vari- ables instead of control charting the output. The flow solder machine has several variables that can be controlled. They include 1. Solder temperature 2. Preheat temperature 3. Conveyor speed 4. Flux type 5. Flux specific gravity 6. Solder wave depth 7. Conveyor angle. In addition to these controllable factors, several other factors cannot be casily controlled during routine manufacturing, although they could be controlled for the purposes of a test. They are 1. Thickness of the printed circuit board 2. Types of components used on the board
Transcribed Image Text:3. Layout of the components on the board 4. Operator 5. Production rate. A flow solder machine is used in the manufacturing process for printed circuit boards. The machine cleans the boards in a flux, preheats the boards, and then moves them along a conveyor through a wave of molten solder. This solder process makes the electrical and mechanical connections for the leaded components on the board. The process currently operates around the I percent defec- tive level. That is, about I percent of the solder joints on a board are defective and require manual retouching. However, because the average printed circuit board contains over 2000 solder joints, even a l percent defective level results in far too many solder joints requiring rework. The process engineer responsible for this area would like to use a designed experi- ment to determine which machine parameters are influential in the occurrence of solder defects and which adjustments should be made to those variables to reduce solder defects. In this situation, engineers are interested in character- izing the flow solder machine; that is, they want to deter- mine which factors (both controllable and uncontrollable) affect the occurrence of defects on the printed circuit boards. To accomplish this, they can design an experiment that will enable them to estimate the magnitude and direc- tion of the factor effects; that is, how much does the response variable (defects per unit) change when each fac- tor is changed, and does changing the factors together produce different results than are obtained from individual factor adjustments-that is, do the factors interact? Sometimes we call an experiment such as this a screening experiment. Typically, screening or characterization exper- iments involve using fractional factorial designs, such as in the golf example in Figure 1.8. The information from this screening or characterization experiment will be used to identify the critical process fac- tors and to determine the direction of adjustment for these factors to reduce further the number of defects per unit. The experiment may also provide information about which fac- tors should be more carefully controlled during routine man- ufacturing to prevent high defect levels and erratic process performance. Thus, one result of the experiment could be the application of techniques such as control charts to one or more process variables (such as solder temperature), in addition to control charts on process output. Over time, if the process is improved enough, it may be possible to base most of the process control plan on controlling process input vari- ables instead of control charting the output. The flow solder machine has several variables that can be controlled. They include 1. Solder temperature 2. Preheat temperature 3. Conveyor speed 4. Flux type 5. Flux specific gravity 6. Solder wave depth 7. Conveyor angle. In addition to these controllable factors, several other factors cannot be casily controlled during routine manufacturing, although they could be controlled for the purposes of a test. They are 1. Thickness of the printed circuit board 2. Types of components used on the board
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