Substrate for Film Deposition (Anode) Sputtering Gas Argon Inlet To Vacuum Pump Ar+ Sputtering Material Target (Cathode) Figure 7 |Rajah 7] Metallization is an adding process that deposit metal layer on the wafer surface by applying sputtering process. Based on Figure 7, explain the mechanism of sputtering machine,

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Substrate for Film
Deposition (Anode)
Sputtering Gas
Argon Inlet
To Vacuum
Pump
Ar+
Sputtering Material
Target (Cathode)
Figure 7
[Rajah 7]
Metallization is an adding process that deposit metal layer on the wafer surface by
applying sputtering process. Based on Figure 7, explain the mechanism of sputtering
machine.
Transcribed Image Text:Substrate for Film Deposition (Anode) Sputtering Gas Argon Inlet To Vacuum Pump Ar+ Sputtering Material Target (Cathode) Figure 7 [Rajah 7] Metallization is an adding process that deposit metal layer on the wafer surface by applying sputtering process. Based on Figure 7, explain the mechanism of sputtering machine.
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