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Silicon wafer is susceptible to warping when the wafer is subjected to temperature difference across its thickness. Thus, steps needed to be taken to prevent the temperature gradient across the wafer thickness from getting large As an engineer in a semiconductor company, your task is to determine the maximum allowable heat flux on the bottom surface of the water, while maintaining the upper surface temperature at 27°C. To prevent the water from warping, the temperature difference across its thickness of 500 mu.m cannot exceed 1°C L=500 μm Tup Tot Silicon wafer

Silicon wafer is susceptible to warping when the wafer is subjected to temperature difference across its thickness. Thus, steps needed to be taken to prevent the temperature gradient across the wafer thickness from getting large As an engineer in a semiconductor company, your task is to determine the maximum allowable heat flux on the bottom surface of the water, while maintaining the upper surface temperature at 27°C. To prevent the water from warping, the temperature difference across its thickness of 500 mu.m cannot exceed 1°C L=500 μm Tup Tot Silicon wafer

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Silicon wafer is susceptible to warping when the wafer is subjected to temperature difference across its thickness. Thus, steps needed to be taken to prevent the temperature gradient across the wafer thickness from getting large As an engineer in a semiconductor company, your task is to determine the maximum allowable heat flux on the bottom surface of the water, while maintaining the upper surface temperature at 27°C. To prevent the water from warping, the temperature difference across its thickness of 500 mu.m cannot exceed 1°C L= 500 μm Tup Tpot Silicon wafer
Transcribed Image Text:Silicon wafer is susceptible to warping when the wafer is subjected to temperature difference across its thickness. Thus, steps needed to be taken to prevent the temperature gradient across the wafer thickness from getting large As an engineer in a semiconductor company, your task is to determine the maximum allowable heat flux on the bottom surface of the water, while maintaining the upper surface temperature at 27°C. To prevent the water from warping, the temperature difference across its thickness of 500 mu.m cannot exceed 1°C L= 500 μm Tup Tpot Silicon wafer
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