QUESTION 22 Which of the following is not a requirement for a recrystalization solvent? O a low boling point to facilitate removal O the desired compound is insoluble at al temperatures O impurities are soluble at ali temperatures O beiling point is lower than the meting point of desired solid O does not react chemically with the desired solid

Chemistry
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ISBN:9781305957404
Author:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
Publisher:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
Chapter1: Chemical Foundations
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Problem 1RQ: Define and explain the differences between the following terms. a. law and theory b. theory and...
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QUESTION 22
Which of the following is not a requirement for a recrystallization solvent?
O a low boiling point to facilitate removal
O the desired compound is insoluble at all temperatures
O impurities are soluble at ali temperatures
O bailing point is lowet than the melting point of desired solid
O does not react chemically with the desired solid
QUESTION 23
Raschig rings were added to the
O 1. West condenser prevent the liquid from bumping
in fractional distillation in order to
O 2, Claisen adapter, increase the rate at which the vapors entered the cendenser
O1 Hempel column, increase the number of theoretical plates
O 4. West condenser, increase the surface area inside the condenser
OS: None of the above
Transcribed Image Text:QUESTION 22 Which of the following is not a requirement for a recrystallization solvent? O a low boiling point to facilitate removal O the desired compound is insoluble at all temperatures O impurities are soluble at ali temperatures O bailing point is lowet than the melting point of desired solid O does not react chemically with the desired solid QUESTION 23 Raschig rings were added to the O 1. West condenser prevent the liquid from bumping in fractional distillation in order to O 2, Claisen adapter, increase the rate at which the vapors entered the cendenser O1 Hempel column, increase the number of theoretical plates O 4. West condenser, increase the surface area inside the condenser OS: None of the above
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