Problem Description: Your programs will be running all semester on a "chip", a CPU. This chip is manufactured on a silicon wafer, a very, very thin circular slice of purified silicon with some impurities added to it. A wafer usually has many chips (or dies) created on its surface, then at one point in the process the dies are sliced apart to make individual CPUS. Your program will do some calculations about these wafers and chips. Given the diameter of the wafer in millimeters (mm) and the area of one individual die in square millimeters (mm^2), this equation will calculate how many dies can be cut from the wafer. The equation does correct for wasted material near the edges. Note that it should give an integer number of dies (you don't want half a die). DPW = dn 4S V25

Database System Concepts
7th Edition
ISBN:9780078022159
Author:Abraham Silberschatz Professor, Henry F. Korth, S. Sudarshan
Publisher:Abraham Silberschatz Professor, Henry F. Korth, S. Sudarshan
Chapter1: Introduction
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Problem Description:
Your programs will be running all semester on a "chip", a CPU. This chip is manufactured on a
silicon wafer, a very, very thin circular slice of purified silicon with some impurities added to
it. A wafer usually has many chips (or dies) created on its surface, then at one point in the process
the dies are sliced apart to make individual CPUS. Your program will do some calculations
about these wafers and chips.
Given the diameter of the wafer in millimeters (mm) and the area of one individual die in square
millimeters (mm^2), this equation will calculate how many dies can be cut from the wafer.
The equation does correct for wasted material near the edges. Note that it should give an integer
number of dies (you don't want half a die).
DPW = dn
4S
V25
Where:
DPW = Die Per Wafer (the number of dies from a wafer)
d = the diameter of the wafer (mm)
S = the chip area (mm2)
Another formula you will need is the area of a circle (the wafer). Look that up and give a
reference to the URL where you found it.
Your program must generate output that matches these sample runs. That includes spelling,
spacing, blank lines and all messages.
Transcribed Image Text:Problem Description: Your programs will be running all semester on a "chip", a CPU. This chip is manufactured on a silicon wafer, a very, very thin circular slice of purified silicon with some impurities added to it. A wafer usually has many chips (or dies) created on its surface, then at one point in the process the dies are sliced apart to make individual CPUS. Your program will do some calculations about these wafers and chips. Given the diameter of the wafer in millimeters (mm) and the area of one individual die in square millimeters (mm^2), this equation will calculate how many dies can be cut from the wafer. The equation does correct for wasted material near the edges. Note that it should give an integer number of dies (you don't want half a die). DPW = dn 4S V25 Where: DPW = Die Per Wafer (the number of dies from a wafer) d = the diameter of the wafer (mm) S = the chip area (mm2) Another formula you will need is the area of a circle (the wafer). Look that up and give a reference to the URL where you found it. Your program must generate output that matches these sample runs. That includes spelling, spacing, blank lines and all messages.
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