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power transistor encapsulated in an aluminum case that is attached at its base yk = 240 W/m-K, thickness L = 8 mm, and width W = 24 mm. The case isj ssure of 1 bar, and the back surface of the plate transfers heat by natural conve gs at T = Tsur = 30°C. The surface has an emissivity of ε = 0.9, and the con pletely enclosed such that heat transfer may be assumed to occur exclusively t

power transistor encapsulated in an aluminum case that is attached at its base yk = 240 W/m-K, thickness L = 8 mm, and width W = 24 mm. The case isj ssure of 1 bar, and the back surface of the plate transfers heat by natural conve gs at T = Tsur = 30°C. The surface has an emissivity of ε = 0.9, and the con pletely enclosed such that heat transfer may be assumed to occur exclusively t

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
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ttempt in pr Consider a power transistor encapsulated in an aluminum case that is attached at its base to a square aluminum plate of thermal conductivity k = 240 W/m-K, thickness L = 8 mm, and width W = 24 mm. The case is joined to the plate by screws that maintain a contact pressure of 1 bar, and the back surface of the plate transfers heat by natural convection and radiation to ambient air and large surroundings at T = Tsur = 30°C. The surface has an emissivity of = 0.9, and the convection coefficient is h = 48 W/m².K. The case is completely enclosed such that heat transfer may be assumed to occur exclusively through the base plate. Ts.p = Your answer is partially correct. 9max 357.9 i Transistor case Ts,c, Pelec 0.5992 Enclosure - If the air-filled aluminum-to-aluminum interface is characterized by an area of Ac = 2 × 10-4 m² and a roughness of 10 μm and the surface temperature of the case, Tsc, is not to exceed 85°C, determine the maximum allowable power dissipation, in W, and the associated surface temperature of the power transistor, Tsp, in K. K 0 W L - Base plate, (k,e) -Interface, Ac -Ts.p 111 Tsur Air To h
Transcribed Image Text:ttempt in pr Consider a power transistor encapsulated in an aluminum case that is attached at its base to a square aluminum plate of thermal conductivity k = 240 W/m-K, thickness L = 8 mm, and width W = 24 mm. The case is joined to the plate by screws that maintain a contact pressure of 1 bar, and the back surface of the plate transfers heat by natural convection and radiation to ambient air and large surroundings at T = Tsur = 30°C. The surface has an emissivity of = 0.9, and the convection coefficient is h = 48 W/m².K. The case is completely enclosed such that heat transfer may be assumed to occur exclusively through the base plate. Ts.p = Your answer is partially correct. 9max 357.9 i Transistor case Ts,c, Pelec 0.5992 Enclosure - If the air-filled aluminum-to-aluminum interface is characterized by an area of Ac = 2 × 10-4 m² and a roughness of 10 μm and the surface temperature of the case, Tsc, is not to exceed 85°C, determine the maximum allowable power dissipation, in W, and the associated surface temperature of the power transistor, Tsp, in K. K 0 W L - Base plate, (k,e) -Interface, Ac -Ts.p 111 Tsur Air To h
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