JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching. • Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. • Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. • Etching: Etching removes selected material from the chip surface to create the device structures. The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer inventory between these steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later stage. Process Step Depositing Patterning 41 34 0.1 0.23 Setup time (min) Processing time (min) Etching 23 0.23 Do not round intermediate calculations. Round your answer to 2 decimal places. a. What is the process capacity in units per hour with a batch size of 150 wafers? Do not round intermediate calculations. Round your answer to 2 decimal places. b. What is the utilization of depositing if the batch size is 150 wafers? units per hour %
JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching. • Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. • Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. • Etching: Etching removes selected material from the chip surface to create the device structures. The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer inventory between these steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later stage. Process Step Depositing Patterning 41 34 0.1 0.23 Setup time (min) Processing time (min) Etching 23 0.23 Do not round intermediate calculations. Round your answer to 2 decimal places. a. What is the process capacity in units per hour with a batch size of 150 wafers? Do not round intermediate calculations. Round your answer to 2 decimal places. b. What is the utilization of depositing if the batch size is 150 wafers? units per hour %
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Transcribed Image Text:JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In
simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching.
• Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a
thin layer of solid material on the chip.
Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like
the emulsion on photographic film. It is repeated many times as each layer of the chip is built.
• Etching: Etching removes selected material from the chip surface to create the device structures.
The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer inventory
between these steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later stage.
Process Step Depositing Patterning
Setup time (min)
41
34
Processing time (min)
0.1
0.23
Etching
23
0.23
Do not round intermediate calculations. Round your answer to 2 decimal places.
a. What is the process capacity in units per hour with a batch size of 150 wafers?
Do not round intermediate calculations. Round your answer to 2 decimal places.
b. What is the utilization of depositing if the batch size is 150 wafers?
units per hour
%
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