In the hanger shown, the upper portion of link ABC is 3/8 in. thick, and the lower portions are each 1/4 in. thick. Epoxy resin is used to bond the upper and lower portions together at B. The pin at A is of 3/4 in. diameter while a 3/8 in. diameter pin is used at C. Determine: 1.25 in. (a) the shearing stress in pin A (b) the shearing stress in pin C (c) the largest normal stress in link ABC (d) the average shearing stress on the bonded surfaces at B (e) the bearing stress in the link at C 1.75 in 7 in. 10 im. 300 Ib

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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In the hanger shown, the upper portion of link ABC is 3/8 in. thick,
and the lower portions are each 1/4 in, thick. Epoxy resin is used
to bond the upper and lower portions together at B. The pin at A
is of 3/4 in. diameter while a 3/8 in. diameter pin is used at C.
Determine:
1.25 in.
(a) the shearing stress in pin A
(b) the shearing stress in pin C
(c) the largest normal stress in link ABC
(d) the average shearing stress on the bonded surfaces at B
(e) the bearing stress in the link at C
6 in.
1.75 in.-
7 in.
j0 in.
300 Ib
5 in
Transcribed Image Text:In the hanger shown, the upper portion of link ABC is 3/8 in. thick, and the lower portions are each 1/4 in, thick. Epoxy resin is used to bond the upper and lower portions together at B. The pin at A is of 3/4 in. diameter while a 3/8 in. diameter pin is used at C. Determine: 1.25 in. (a) the shearing stress in pin A (b) the shearing stress in pin C (c) the largest normal stress in link ABC (d) the average shearing stress on the bonded surfaces at B (e) the bearing stress in the link at C 6 in. 1.75 in.- 7 in. j0 in. 300 Ib 5 in
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