from the back side of the board to a medium at 37°C, with a heat transfer coefficient of 45 W/m²-K. (a) Determine the surface temperatures on the two sides of the circuit board. (b) Now a 0.1-cm-thick, 10-cm-high, and 15-cm-long alumi- num plate (k = 237 W/m-K) with 20 0.2-cm-thick, 2-cm-long, and 15-cm-wide aluminum fins of rectangular profile are at- tached to the back side of the circuit board with a 0.03-cm- thick epoxy adhesive (k = 1.8 W/m-K). Determine the new temperatures on the two sides of the circuit board. Electronic components Fin 15 cm 10.3 cm 10 cm 0.2 cm - 20 fins 2 cm 1 mm 2 mm FIGURE P3-190
from the back side of the board to a medium at 37°C, with a heat transfer coefficient of 45 W/m²-K. (a) Determine the surface temperatures on the two sides of the circuit board. (b) Now a 0.1-cm-thick, 10-cm-high, and 15-cm-long alumi- num plate (k = 237 W/m-K) with 20 0.2-cm-thick, 2-cm-long, and 15-cm-wide aluminum fins of rectangular profile are at- tached to the back side of the circuit board with a 0.03-cm- thick epoxy adhesive (k = 1.8 W/m-K). Determine the new temperatures on the two sides of the circuit board. Electronic components Fin 15 cm 10.3 cm 10 cm 0.2 cm - 20 fins 2 cm 1 mm 2 mm FIGURE P3-190
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter2: Steady Heat Conduction
Section: Chapter Questions
Problem 2.38P:
2.38 The addition of aluminum fins has been suggested to increase the rate of heat dissipation from...
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