Federal Semiconductors issued 11% bonds, dated January 1, with a face amount of $800 million on January 1, 2021. The bonds sold for $739,814,813 and mature on December 31, 2040 (20 years). For bonds of similar risk and maturity the market yield was 12%. Interest is paid semiannually on June 30 and December 31. Required: 1. to 3. Prepare the journal entries to record their issuance by Federal on January 1, 2021, interest on June 30, 2021 (at the effective rate) and interest on December 31, 2021 (at the effective rate). 4. At what amount will Federal report the bonds among its liabilities in the December 31, 2021, balance sheet? Complete this question by entering your answers in the tabs below. Req 1 to 3 Req 4 ....... At what amount will Federal report the bonds among its liabilities in the December 31, 2021, balance sheet? (Enter your answers in whole dollars.) Cash Interest Paid Bond Interest Discount Amortization Period-End Expense Carrying Value 01/01/2021 06/30/2021 12/31/2021 < Req 1 to 3

FINANCIAL ACCOUNTING
10th Edition
ISBN:9781259964947
Author:Libby
Publisher:Libby
Chapter1: Financial Statements And Business Decisions
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Federal Semiconductors issued 11% bonds, dated January 1, with a face amount of $800 million on January 1, 2021. The bonds sold for
$739,814,813 and mature on December 31, 2040 (20 years). For bonds of similar risk and maturity the market yield was 12%. Interest is
paid semiannually on June 30 and December 31.
Required:
1. to 3. Prepare the journal entries to record their issuance by Federal on January 1, 2021, interest on June 30, 2021 (at the effective
rate) and interest on December 31, 2021 (at the effective rate).
4. At what amount will Federal report the bonds among its liabilities in the December 31, 2021, balance sheet?
Complete this question by entering your answers in the tabs below.
Req 1 to 3
Req 4
重
At what amount will Federal report the bonds among its liabilities in the December 31, 2021, balance sheet? (Enter your
answers in whole dollans.)
Cash Interest
Paid
Bond Interest
Expense
Discount
Amortization
Period-End
Carrying Value
01/01/2021
06/30/2021
12/31/2021
く
Req 1 to 3
Transcribed Image Text:Federal Semiconductors issued 11% bonds, dated January 1, with a face amount of $800 million on January 1, 2021. The bonds sold for $739,814,813 and mature on December 31, 2040 (20 years). For bonds of similar risk and maturity the market yield was 12%. Interest is paid semiannually on June 30 and December 31. Required: 1. to 3. Prepare the journal entries to record their issuance by Federal on January 1, 2021, interest on June 30, 2021 (at the effective rate) and interest on December 31, 2021 (at the effective rate). 4. At what amount will Federal report the bonds among its liabilities in the December 31, 2021, balance sheet? Complete this question by entering your answers in the tabs below. Req 1 to 3 Req 4 重 At what amount will Federal report the bonds among its liabilities in the December 31, 2021, balance sheet? (Enter your answers in whole dollans.) Cash Interest Paid Bond Interest Expense Discount Amortization Period-End Carrying Value 01/01/2021 06/30/2021 12/31/2021 く Req 1 to 3
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Bonds are the highly secured bonds for which bondholders are the creditors of the entity. Bonds are redeemed after a certain span of time. 

 

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