Answered: Diamond blade- 0.75 mm thickness Si…

Chemistry

10th Edition

ISBN:9781305957404

Author:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste

Publisher:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste

Chapter1: Chemical Foundations

Section: Chapter Questions

Problem 1RQ: Define and explain the differences between the following terms. a. law and theory b. theory and...

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Question

Silicon for computer chips is grown in large cylinders called
“boules” that are 300 mm in diameter and 2 m in length, as
shown. The density of silicon is 2.33 g/cm³. Silicon wafers
for making integrated circuits are sliced from a 2.0-m boule
and are typically 0.75 mm thick and 300 mm in diameter.
(a) How many wafers can be cut from a single boule?
(b) What is the mass of a silicon wafer? (The volume of a cylinder
is given by πr²h, where r is the radius and h is its height.)

Diamond blade-
0.75 mm
thickness
Si boule
- 300 mm
diameter
Cut wafers
2 m

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