"Delamination is defined as separation between two supposedly connected layer interfaces within a package. It is generally considered more as a failure attribute rather than as a failure mechanism" a)As an engineer, please suggest the mechanisms and modes of failure that can arise from the presence of internal delamination of the package. b)There is a failure analysis technique that can be used to detect delamination in IC, please suggest and explain in detail about it.
"Delamination is defined as separation between two supposedly connected layer interfaces within a package. It is generally considered more as a failure attribute rather than as a failure mechanism" a)As an engineer, please suggest the mechanisms and modes of failure that can arise from the presence of internal delamination of the package. b)There is a failure analysis technique that can be used to detect delamination in IC, please suggest and explain in detail about it.
Database System Concepts
7th Edition
ISBN:9780078022159
Author:Abraham Silberschatz Professor, Henry F. Korth, S. Sudarshan
Publisher:Abraham Silberschatz Professor, Henry F. Korth, S. Sudarshan
Chapter1: Introduction
Section: Chapter Questions
Problem 1PE
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"Delamination is defined as separation between two supposedly connected layer interfaces within a package. It is generally considered more as a failure attribute rather than as a failure
a)As an engineer, please suggest the mechanisms and modes of failure that can arise from the presence of internal delamination of the package.
b)There is a failure analysis technique that can be used to detect delamination in IC, please suggest and explain in detail about it.
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