Consider a non-ideal MOSFET that has been fabricated on a siliconwafer with initial uniform boron doping of 7.5 × 1015 cm-3. The gateoxide has a thickness tox = 35 nm, fixed charge Qf /q = 5.0 × 1010 cm-2and mobile charge Qm /q = 2.5 × 1010 cm-2 (assume other oxidecharges are negligibly small). The gate has been fabricated frompolysilicon to give a gate length of 150 nm. The work functiondifference between the polysilicon gate and the silicon is –0.35 V.Assuming a temperature of 300 K and ignoring short channel effects,calculate the threshold voltage of the MOSFET if there is zero biasapplied between the source and the silicon substrate.

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Consider a non-ideal MOSFET that has been fabricated on a silicon
wafer with initial uniform boron doping of 7.5 × 1015 cm-3. The gate
oxide has a thickness tox = 35 nm, fixed charge Qf /q = 5.0 × 1010 cm-2
and mobile charge Qm /q = 2.5 × 1010 cm-2 (assume other oxide
charges are negligibly small). The gate has been fabricated from
polysilicon to give a gate length of 150 nm. The work function
difference between the polysilicon gate and the silicon is –0.35 V.
Assuming a temperature of 300 K and ignoring short channel effects,
calculate the threshold voltage of the MOSFET if there is zero bias
applied between the source and the silicon substrate.

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