Consider a 6-in * 8-in epoxy glass laminate (k = 0.10 Btu/h·ft·°F) whose thickness is 0.05 in. In order to reduce the thermal resistance across its thickness, cylindrical copper fillings (k = 223 Btu/h·ft·°F) of 0.02 in diameter are to be planted throughout the board, with a center-to-center distance of 0.06 in. Determine the new value of the thermal resistance of the epoxy board for heat conduction across its thickness as a result of this modification.
Energy transfer
The flow of energy from one region to another region is referred to as energy transfer. Since energy is quantitative; it must be transferred to a body or a material to work or to heat the system.
Molar Specific Heat
Heat capacity is the amount of heat energy absorbed or released by a chemical substance per the change in temperature of that substance. The change in heat is also called enthalpy. The SI unit of heat capacity is Joules per Kelvin, which is (J K-1)
Thermal Properties of Matter
Thermal energy is described as one of the form of heat energy which flows from one body of higher temperature to the other with the lower temperature when these two bodies are placed in contact to each other. Heat is described as the form of energy which is transferred between the two systems or in between the systems and their surrounding by the virtue of difference in temperature. Calorimetry is that branch of science which helps in measuring the changes which are taking place in the heat energy of a given body.
Consider a 6-in * 8-in epoxy glass laminate (k =
0.10 Btu/h·ft·°F) whose thickness is 0.05 in. In order to
reduce the thermal resistance across its thickness, cylindrical
copper fillings (k = 223 Btu/h·ft·°F) of 0.02 in diameter
are to be planted throughout the board, with a center-to-center
distance of 0.06 in. Determine the new value of the thermal
resistance of the epoxy board for heat
Trending now
This is a popular solution!
Step by step
Solved in 6 steps with 6 images