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Because of the large number of devices in today's PC D9aog chips, finned heat sinks are often used to maintain the chip at an acceptable operating temperature. Two fin ed designs are to be evaluated, both of which have base (unfinned) area dimensions of 53 mm X 57 mm. The fins are of square cross section and fabricated from an extruded aluminum alloy with a thermal conductivity of 175 W/m K. Cooling air may be supplied at 25°C, and the maximum allowable chip temperature is 75°C, Other features of the design and operating conditions Determine which fin arrangement is superior. In your analysis, calculate the heat rate, efficiency, and effec tiveness of a single fin, as well as the total heat rate and overall efficiency of the array. Since real estate inside the computer enclosure is important, compare the total heat rate per unit volume for the two designs, are tabulated. Fin Dimensions Convection Cross Section w X w (mm) Length L (mm) Fins in Array (W/m2 K) Number of Coefficient Design A 3 X 3 30 6 × 9 125 1x1 7 14 × 17 375

Because of the large number of devices in today's PC D9aog chips, finned heat sinks are often used to maintain the chip at an acceptable operating temperature. Two fin ed designs are to be evaluated, both of which have base (unfinned) area dimensions of 53 mm X 57 mm. The fins are of square cross section and fabricated from an extruded aluminum alloy with a thermal conductivity of 175 W/m K. Cooling air may be supplied at 25°C, and the maximum allowable chip temperature is 75°C, Other features of the design and operating conditions Determine which fin arrangement is superior. In your analysis, calculate the heat rate, efficiency, and effec tiveness of a single fin, as well as the total heat rate and overall efficiency of the array. Since real estate inside the computer enclosure is important, compare the total heat rate per unit volume for the two designs, are tabulated. Fin Dimensions Convection Cross Section w X w (mm) Length L (mm) Fins in Array (W/m2 K) Number of Coefficient Design A 3 X 3 30 6 × 9 125 1x1 7 14 × 17 375

Computer Networking: A Top-Down Approach (7th Edition)
Computer Networking: A Top-Down Approach (7th Edition)
7th Edition
ISBN:9780133594140
Author:James Kurose, Keith Ross
Publisher:James Kurose, Keith Ross
Chapter1: Computer Networks And The Internet
Section: Chapter Questions
Problem R1RQ: What is the difference between a host and an end system? List several different types of end...
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Because of the large number of devices in today's PC D9aog chips, finned heat sinks are often used to maintain the golchip at an acceptable operating temperature. Two fin ad designs are to be evaluated, both of which have base (unfinned) area dimensions of 53 mm X 57 mm. The fins are of square cross section and fabricated from an extruded aluminum alloy with a thermal conductivity of 175 W/m K. Cooling air may be supplied at 25°C, and the maximum allowable chip temperature is 75°C. Other features of the design and operating conditions Determine which fin arrangement is superior. In your analysis, calculate the heat rate, efficiency, and effec tiveness of a single fin, as well as the total heat rate and overall efficiency of the array. Since real estate inside the computer enclosure is important, compare the total heat rate per unit volume for the two designs. are tabulated. Fin Dimensions Convection Coefficient L (mm) Fins in Array (W/m2 K) Cross Section Length Number of Design w x w (mm) A 3 X 3 30 6 x 9 125 B 1x1 14 X 17 375 57 mm -L = 30 mm- 53 mm ロロロ 3 mm x 3 mm T, = 75°C cross section L54 pins, 9 x 6 array (Design A)
Transcribed Image Text:Because of the large number of devices in today's PC D9aog chips, finned heat sinks are often used to maintain the golchip at an acceptable operating temperature. Two fin ad designs are to be evaluated, both of which have base (unfinned) area dimensions of 53 mm X 57 mm. The fins are of square cross section and fabricated from an extruded aluminum alloy with a thermal conductivity of 175 W/m K. Cooling air may be supplied at 25°C, and the maximum allowable chip temperature is 75°C. Other features of the design and operating conditions Determine which fin arrangement is superior. In your analysis, calculate the heat rate, efficiency, and effec tiveness of a single fin, as well as the total heat rate and overall efficiency of the array. Since real estate inside the computer enclosure is important, compare the total heat rate per unit volume for the two designs. are tabulated. Fin Dimensions Convection Coefficient L (mm) Fins in Array (W/m2 K) Cross Section Length Number of Design w x w (mm) A 3 X 3 30 6 x 9 125 B 1x1 14 X 17 375 57 mm -L = 30 mm- 53 mm ロロロ 3 mm x 3 mm T, = 75°C cross section L54 pins, 9 x 6 array (Design A)
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