An IC with a surface area of 4,000 mm2 is cooled by a heatsink attached to its top surface.  The thermal paste attaching the heatsink to the surface has a thermal conductivity of kpaste = 0.4 W/mK and a thickness of 2mm.  The paste was applied incorrectly in the factory and also has an additional thermal contact conductance of hc = 20,000 W/m2K.       The manufacturer gives a combined thermal resistance of 1.8 K/W for the heatsink.  If the IC is dissipating 120W of heat into a surrounding temperature of 45 oC air with h = 18 W/mK, determine: a) The temperature of the top of the IC (assume the bottom is perfectly insulated). b) Does the additional thermal contact conductance of the paste (due to incorrect application) play a significant role in the heat dissipation?

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Conduction and Convection

When energy travels from one object to another it is said to have undergone heat transfer. Heat transfer is nothing but the transfer of thermal energy or internal energy from one thing to another, like e.g., when a vessel with water, kept on top of a burner, heats up because of the flame underneath it.