An article in Wood Science and Technology, "Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and Level of Stressing on Rate of Creep and Time to Failure" (1981, Vol. 15, pp. 125-144) studied the deflection (mm) of particleboard from stress levels of relative humidity. Assume that the two variables are related according to the simple linear regression model. The data are shown below x = Stress level (%) 54 54 61 61 68 68 75 75 75
An article in Wood Science and Technology, "Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and Level of Stressing on Rate of Creep and Time to Failure" (1981, Vol. 15, pp. 125-144) studied the deflection (mm) of particleboard from stress levels of relative humidity. Assume that the two variables are related according to the simple linear regression model. The data are shown below x = Stress level (%) 54 54 61 61 68 68 75 75 75
MATLAB: An Introduction with Applications
6th Edition
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Author:Amos Gilat
Publisher:Amos Gilat
Chapter1: Starting With Matlab
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Related questions
Question
d and e
![An article in Wood Science and Technology, "Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and
Level of Stressing on Rate of Creep and Time to Failure" (1981, Vol. 15, pp. 125-144) studied the deflection (mm) of particleboard from
stress levels of relative humidity. Assume that the two variables are related according to the simple linear regression model. The data
are shown below
x = Stress level (%)
54
54
61
61
68
68
75
75
75
y = Deflection (mm) 16.473 18.693 14.305
15.121 13.505 11.64 11.168 12.534 11.224
a. Calculate the least square estimates of the intercept (a) and slope (b). What is the estimate of o² (c)?
b. Find the estimate of the mean deflection if the stress level can be limited to 66% (d).
c. Estimate the change in the mean deflection associated with a 6% increment in stress level (e).
(a) i
(Round your answer to 2 decimal places.)
(b) i
(Round your answer to 3 decimal places.)
(c) i
(Round your answer to 3 decimal places.)
(d)
(Round your answer to 2 decimal places.)
(e)
(Round your answer to 3 decimal places.)](/v2/_next/image?url=https%3A%2F%2Fcontent.bartleby.com%2Fqna-images%2Fquestion%2F6684c23c-8405-414e-825d-bce92746ac23%2F654959a2-c034-48e1-b424-3fef6cc40e38%2Flpk1bbj_processed.jpeg&w=3840&q=75)
Transcribed Image Text:An article in Wood Science and Technology, "Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and
Level of Stressing on Rate of Creep and Time to Failure" (1981, Vol. 15, pp. 125-144) studied the deflection (mm) of particleboard from
stress levels of relative humidity. Assume that the two variables are related according to the simple linear regression model. The data
are shown below
x = Stress level (%)
54
54
61
61
68
68
75
75
75
y = Deflection (mm) 16.473 18.693 14.305
15.121 13.505 11.64 11.168 12.534 11.224
a. Calculate the least square estimates of the intercept (a) and slope (b). What is the estimate of o² (c)?
b. Find the estimate of the mean deflection if the stress level can be limited to 66% (d).
c. Estimate the change in the mean deflection associated with a 6% increment in stress level (e).
(a) i
(Round your answer to 2 decimal places.)
(b) i
(Round your answer to 3 decimal places.)
(c) i
(Round your answer to 3 decimal places.)
(d)
(Round your answer to 2 decimal places.)
(e)
(Round your answer to 3 decimal places.)
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