A transparent film will be glued onto an upper surface of a solid plate within a heated chamber. For common gluing, the temperature between the glue, a film and the solid board must be kept at 70 °C. The transparent film has a thickness of 1 mm and thermal conductivity 0.05 W/mK, while the solid board is 13 mm thick. thickness and thermal conductivity of 1.2 W / mK. Inside the climate chamber, the convection heat transfer coefficient is 70 W/m²K. The bottom surface of the solid plate is kept at 52 °C, determines the temperature inside the heated chamber and the temperature of the surface of the transparent film. Assume negligible thermal contact resistance.
A transparent film will be glued onto an upper surface of a solid plate within a heated chamber. For common gluing, the temperature between the glue, a film and the solid board must be kept at 70 °C. The transparent film has a thickness of 1 mm and thermal conductivity 0.05 W/mK, while the solid board is 13 mm thick. thickness and thermal conductivity of 1.2 W / mK. Inside the climate chamber, the convection heat transfer coefficient is 70 W/m²K. The bottom surface of the solid plate is kept at 52 °C, determines the temperature inside the heated chamber and the temperature of the surface of the transparent film. Assume negligible thermal contact resistance.
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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A transparent film will be glued onto an upper surface of a solid plate within a heated chamber.
For common gluing, the temperature between the glue, a film and the solid board must be kept at 70 °C. The transparent film has a thickness of 1 mm and thermal conductivity 0.05 W/mK, while the solid board is 13 mm thick. thickness and thermal conductivity of 1.2 W / mK. Inside the climate chamber, the convection heat transfer coefficient is 70 W/m²K.
The bottom surface of the solid plate is kept at 52 °C, determines the temperature inside the heated chamber and the temperature of the surface of the transparent film. Assume negligible thermal contact resistance.
Transcribed Image Text:TRANSPARENT FILM
k = 0,05 W/m-K
Ar, h = 70 W/m²-K
L
1 mm
Т, — 70 °C
SOLID BOARD
k, = 1,2 W/m·K
L = 13 mm
T, = 52 °C
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