A square silicon chip 7 mm x 7 mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is coole by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate th W mK steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 Silicon chip Synthetic liquid Substrate
A square silicon chip 7 mm x 7 mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is coole by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate th W mK steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 Silicon chip Synthetic liquid Substrate
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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Transcribed Image Text:A square silicon chip 7 mm x 7 mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled
by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the
W
steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150
Silicon chip
Synthetic liquid
Substrate
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