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A silicon chip measuring 5 mm on a side and 1 mm in thickness is embedded in a ceramic substrate. At steady state, the chip has an electrical power input of 0.425 W. The top surface of the chip is exposed

A silicon chip measuring 5 mm on a side and 1 mm in thickness is embedded in a ceramic substrate. At steady state, the chip has an electrical power input of 0.425 W. The top surface of the chip is exposed

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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A silicon chip measuring 5 mm on a side and 1 mm in thickness is embedded in a ceramic substrate. At steady state, the chip has an electrical power input of 0.425 W. The top surface of the chip is exposed to a coolant whose temperature is 29°C. The heat transfer coefficient for convection between the chip and the coolant is 0.18 kW/m2 K. If heat transfer by conduction between the chip and the substrate is negligible, determine the surface temperature of the chip, in °R.
Transcribed Image Text:A silicon chip measuring 5 mm on a side and 1 mm in thickness is embedded in a ceramic substrate. At steady state, the chip has an electrical power input of 0.425 W. The top surface of the chip is exposed to a coolant whose temperature is 29°C. The heat transfer coefficient for convection between the chip and the coolant is 0.18 kW/m2 K. If heat transfer by conduction between the chip and the substrate is negligible, determine the surface temperature of the chip, in °R.
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