A 0.3-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely spaced logic chips on one side, each dissipating 0.04 W. The board is impregnated with copper fillings and has an effective thermal conductivity of 20 W/m-°C. All the heat generated in the chips is conducted across the circuit board and is dissipated from the back side of the board to a medium at 40°C, with a heat transfer coefficient of 50 W/m2.°C. a. Determine the temperatures on the two sides of the circuit board. b. Now a 0.2-cm-thick, 12-cm-high, and 18-cm-long copper plate (k= 386 W/m-°C) with 864 2-cm-long copper pin fins of diameter 0.25 cm is attached to the back side of the circuit board with a 0.02-cm-thick epoxy adhesive (k = 1.8 W/m-°C). Determine the new temperatures on the two sides of the circuit board.
A 0.3-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely spaced logic chips on one side, each dissipating 0.04 W. The board is impregnated with copper fillings and has an effective thermal conductivity of 20 W/m-°C. All the heat generated in the chips is conducted across the circuit board and is dissipated from the back side of the board to a medium at 40°C, with a heat transfer coefficient of 50 W/m2.°C. a. Determine the temperatures on the two sides of the circuit board. b. Now a 0.2-cm-thick, 12-cm-high, and 18-cm-long copper plate (k= 386 W/m-°C) with 864 2-cm-long copper pin fins of diameter 0.25 cm is attached to the back side of the circuit board with a 0.02-cm-thick epoxy adhesive (k = 1.8 W/m-°C). Determine the new temperatures on the two sides of the circuit board.
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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Transcribed Image Text:A 0.3-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely spaced
logic chips on one side, each dissipating 0.04 W. The board is impregnated with
copper fillings and has an effective thermal conductivity of 20 W/m-°C. All the heat
generated in the chips is conducted across the circuit board and is dissipated from the
back side of the board to a medium at 40°C, with a heat transfer coefficient of 50
W/m2.°C.
a. Determine the temperatures on the two sides of the circuit board.
b. Now a 0.2-cm-thick, 12-cm-high, and 18-cm-long copper plate (k = 386 W/m-°C)
with 864 2-cm-long copper pin fins of diameter 0.25 cm is attached to the back side
of the circuit board with a 0.02-cm-thick epoxy adhesive (k = 1.8 W/m-°C).
Determine the new temperatures on the two sides of the circuit board.
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