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9-50) describes the application of t integrated circuit manufacturing o grow an epitaxial layer on poli- fers mounted on a susceptor are p d chemical vapors are introduced. nd heat is applied until the epitax an experiment was run using two ) and deposition time (B). Four m pitaxial layer thickness was measur in Table P6.1. 11 Replicate 6.165 3.860 4.757 4.921 13.972 14.032 14.843 14.415 IV 13.907 13.914 14.878 14.932

9-50) describes the application of t integrated circuit manufacturing o grow an epitaxial layer on poli- fers mounted on a susceptor are p d chemical vapors are introduced. nd heat is applied until the epitax an experiment was run using two ) and deposition time (B). Four m pitaxial layer thickness was measur in Table P6.1. 11 Replicate 6.165 3.860 4.757 4.921 13.972 14.032 14.843 14.415 IV 13.907 13.914 14.878 14.932

MATLAB: An Introduction with Applications
MATLAB: An Introduction with Applications
6th Edition
ISBN:9781119256830
Author:Amos Gilat
Publisher:Amos Gilat
Chapter1: Starting With Matlab
Section: Chapter Questions
Problem 1P
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Question4: An article in the AT&T Technical Journal (March/April 1986, Vol. 65, pp. 39-50) describes the application of two-level factorial designs to integrated circuit manufacturing. A basic processing step is to grow an epitaxial layer on polished sili- con wafers. The wafers mounted on a susceptor are positioned inside a bell jar, and chemical vapors are introduced. The sus- ceptor is rotated, and heat is applied until the epitaxial layer is thick enough. An experiment was run using two factors: arsenic flow rate (A) and deposition time (B). Four replicates were run, and the epitaxial layer thickness was measured (μm). The data are shown in Table P6.1. TABLE P6.1 The 2¹ Design for Problem 6.16 A B I 14.037 13.880 14.821 14.888 11 Replicate 16.165 13.860 14.757 14.921 III 13.972 14.032 14.843 14.415 IV 13.907 13.914 14.878 14.932 A 8 Factor Levels Low (-) 55% Short (10 min) (a) Estimate the factor effects. (b) Conduct an analysis of variance. Which factors are important? (e) Write down a regression equation that could be used to predict epitaxial layer thickness over the region of arsenic flow rate and deposition time used in this experiment. (d) Analyze the residuals. Are there any residuals that should cause concern? (e) Discuss how you might deal with the potential outlier found in part (d). High (+) 59% Long (15 min)
Transcribed Image Text:Question4: An article in the AT&T Technical Journal (March/April 1986, Vol. 65, pp. 39-50) describes the application of two-level factorial designs to integrated circuit manufacturing. A basic processing step is to grow an epitaxial layer on polished sili- con wafers. The wafers mounted on a susceptor are positioned inside a bell jar, and chemical vapors are introduced. The sus- ceptor is rotated, and heat is applied until the epitaxial layer is thick enough. An experiment was run using two factors: arsenic flow rate (A) and deposition time (B). Four replicates were run, and the epitaxial layer thickness was measured (μm). The data are shown in Table P6.1. TABLE P6.1 The 2¹ Design for Problem 6.16 A B I 14.037 13.880 14.821 14.888 11 Replicate 16.165 13.860 14.757 14.921 III 13.972 14.032 14.843 14.415 IV 13.907 13.914 14.878 14.932 A 8 Factor Levels Low (-) 55% Short (10 min) (a) Estimate the factor effects. (b) Conduct an analysis of variance. Which factors are important? (e) Write down a regression equation that could be used to predict epitaxial layer thickness over the region of arsenic flow rate and deposition time used in this experiment. (d) Analyze the residuals. Are there any residuals that should cause concern? (e) Discuss how you might deal with the potential outlier found in part (d). High (+) 59% Long (15 min)
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