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6. The linear expansion coefficient of a glass mask plate is 9x10“/ °C and that of silicon is 2.3x10/ °C. The maximum allowable error due to thermal run in/out is ± 0.5µm across a 100 mm diameter Si wafer. Calculate the required ambient temperature tolerance for: a) Contact printing – assuming mask and wafer are at room temperature Wafer thermal expansion b) Projection printing – the mask temperature is controlled to be fixed but the Si wafer will Original wafer follow the ambient temperature. Center point You can assume that the wafer and mask will Max 0.5 um always stay centered.

6. The linear expansion coefficient of a glass mask plate is 9x10“/ °C and that of silicon is 2.3x10/ °C. The maximum allowable error due to thermal run in/out is ± 0.5µm across a 100 mm diameter Si wafer. Calculate the required ambient temperature tolerance for: a) Contact printing – assuming mask and wafer are at room temperature Wafer thermal expansion b) Projection printing – the mask temperature is controlled to be fixed but the Si wafer will Original wafer follow the ambient temperature. Center point You can assume that the wafer and mask will Max 0.5 um always stay centered.

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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6. The linear expansion coefficient of a glass mask plate is 9x10“/ °C and that of silicon is 2.3x106/ °C. The maximum allowable error due to thermal run in/out is + 0.5µm across a 100 mm diameter Si wafer. Calculate the required ambient temperature tolerance for: a) Contact printing – assuming mask and wafer Wafer thermal expansion are at room temperature b) Projection printing – the mask temperature is controlled to be fixed but the Si wafer will Original wafer follow the ambient temperature. Center point You can assume that the wafer and mask will Мах 0.S um always stay centered.
Transcribed Image Text:6. The linear expansion coefficient of a glass mask plate is 9x10“/ °C and that of silicon is 2.3x106/ °C. The maximum allowable error due to thermal run in/out is + 0.5µm across a 100 mm diameter Si wafer. Calculate the required ambient temperature tolerance for: a) Contact printing – assuming mask and wafer Wafer thermal expansion are at room temperature b) Projection printing – the mask temperature is controlled to be fixed but the Si wafer will Original wafer follow the ambient temperature. Center point You can assume that the wafer and mask will Мах 0.S um always stay centered.
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