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[2] An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k = 180 W/m .. K). The base of the heat sink has dimensions of w1 = W2 = 100 mm, while the 6 fins are of thickness t = 10 mm and pitch S = 18 mm. The fin length is Lr = 50 mm, and the base of the heat sink has a thickness of Lb = 10 mm. Chips Water u, T Electronic- package, Pelec If cooling is implemented by water flow through the heat sink, with uo = 3 m/s and T0 = 17°C, what is the base temperature Tb of the heat sink when power dissipation by the chips is Pelec = 1800 W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate. Properties of the water may be approximated as k = 0.62 W/m-K, p 995 kg/m3, Cp = 4178 J/kg-K, v = 7.73 x 10-7 m2/s, and Pr = 5.2. a.) Base temperature. A. 37.8°C С. 31.4°С D. 46.2°C B. 43.9°C

[2] An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k = 180 W/m .. K). The base of the heat sink has dimensions of w1 = W2 = 100 mm, while the 6 fins are of thickness t = 10 mm and pitch S = 18 mm. The fin length is Lr = 50 mm, and the base of the heat sink has a thickness of Lb = 10 mm. Chips Water u, T Electronic- package, Pelec If cooling is implemented by water flow through the heat sink, with uo = 3 m/s and T0 = 17°C, what is the base temperature Tb of the heat sink when power dissipation by the chips is Pelec = 1800 W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate. Properties of the water may be approximated as k = 0.62 W/m-K, p 995 kg/m3, Cp = 4178 J/kg-K, v = 7.73 x 10-7 m2/s, and Pr = 5.2. a.) Base temperature. A. 37.8°C С. 31.4°С D. 46.2°C B. 43.9°C

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
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[2] An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k = 180 W/m K). The base of the heat sink has dimensions of w1 = W2 = 100 mm, while the 6 fins are of thickness t = 10 mm and pitch S = 18 mm. The fin length is Lr = 50 mm, and the base of the heat sink has a thickness of Lb = 10 mm. L -Chips Water u T Electronic package, P elec If cooling is implemented by water flow through the heat sink, with uo = 3 m/s and To = temperature Tb of the heat sink when power dissipation by the chips is Pelec = 1800 W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate. Properties of the water may be approximated as k = 0.62 W/m-K, p = 995 kg/m3, Cp = 4178 J/kg-K, v = 7.73 x 10-7 m2/s, and Pr = 5.2. 17°C, what is the base a.) Base temperature. А. 37.8°C B. 43.9°C С. 31.4°С D. 46.2°C
Transcribed Image Text:[2] An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k = 180 W/m K). The base of the heat sink has dimensions of w1 = W2 = 100 mm, while the 6 fins are of thickness t = 10 mm and pitch S = 18 mm. The fin length is Lr = 50 mm, and the base of the heat sink has a thickness of Lb = 10 mm. L -Chips Water u T Electronic package, P elec If cooling is implemented by water flow through the heat sink, with uo = 3 m/s and To = temperature Tb of the heat sink when power dissipation by the chips is Pelec = 1800 W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate. Properties of the water may be approximated as k = 0.62 W/m-K, p = 995 kg/m3, Cp = 4178 J/kg-K, v = 7.73 x 10-7 m2/s, and Pr = 5.2. 17°C, what is the base a.) Base temperature. А. 37.8°C B. 43.9°C С. 31.4°С D. 46.2°C
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