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2-61. Consider the data on wafer contamination and loca- tion in the sputtering tool shown in Table 2-2. Assume that one wafer is selected at random from this set. Let A denote the event that a wafer contains four or more particles, and let B denote the event that a wafer is from the center of the sputter- ing tool. Determine: (а) Р(А) (с) Р(В) (e) P(A N B) (b) Р(А|В) (d) Р(B|4) (f) P(A U B)

2-61. Consider the data on wafer contamination and loca- tion in the sputtering tool shown in Table 2-2. Assume that one wafer is selected at random from this set. Let A denote the event that a wafer contains four or more particles, and let B denote the event that a wafer is from the center of the sputter- ing tool. Determine: (а) Р(А) (с) Р(В) (e) P(A N B) (b) Р(А|В) (d) Р(B|4) (f) P(A U B)

A First Course in Probability (10th Edition)
A First Course in Probability (10th Edition)
10th Edition
ISBN:9780134753119
Author:Sheldon Ross
Publisher:Sheldon Ross
Chapter1: Combinatorial Analysis
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Problem 1.1P: a. How many different 7-place license plates are possible if the first 2 places are for letters and...
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2-61. Consider the data on wafer contamination and loca- tion in the sputtering tool shown in Table 2-2. Assume that one wafer is selected at random from this set. Let A denote the event that a wafer contains four or more particles, and let B denote the event that a wafer is from the center of the sputter- ing tool. Determine: (a) P(A) (c) P(B) (e) P(A N B) (f) P(AU B) () Р(А|В) (d) P(B|A)
Transcribed Image Text:2-61. Consider the data on wafer contamination and loca- tion in the sputtering tool shown in Table 2-2. Assume that one wafer is selected at random from this set. Let A denote the event that a wafer contains four or more particles, and let B denote the event that a wafer is from the center of the sputter- ing tool. Determine: (a) P(A) (c) P(B) (e) P(A N B) (f) P(AU B) () Р(А|В) (d) P(B|A)
Table 2-2 Wafers Classified by Contamination and Location Number of Contamination Particles Center Edge Totals 0.30 0.10 0.40 1 0.15 0.05 0.20 0.10 0.05 0.15 3 0.06 0.04 0.10 4 0.04 0.01 0.05 5 or more 0.07 0.03 0.10 Totals 0.72 0.28 1.00
Transcribed Image Text:Table 2-2 Wafers Classified by Contamination and Location Number of Contamination Particles Center Edge Totals 0.30 0.10 0.40 1 0.15 0.05 0.20 0.10 0.05 0.15 3 0.06 0.04 0.10 4 0.04 0.01 0.05 5 or more 0.07 0.03 0.10 Totals 0.72 0.28 1.00
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