10)Which of the following statements are correct regarding the Adhesive bonding process? a. Bonding relies on the attractive forces between the molecules at the surface of the adhesive and that of the surfaces to be joined. b. The smaller molecules provide better adhesion. c. The liquid adhesives do not require any form of curing. d. The curing temperature is always maintained at over 500°C.
10)Which of the following statements are correct regarding the Adhesive bonding process? a. Bonding relies on the attractive forces between the molecules at the surface of the adhesive and that of the surfaces to be joined. b. The smaller molecules provide better adhesion. c. The liquid adhesives do not require any form of curing. d. The curing temperature is always maintained at over 500°C.
Chapter2: Loads On Structures
Section: Chapter Questions
Problem 1P
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Question
![10)Which of the following statements are
correct regarding the Adhesive bonding
process?
a. Bonding relies on the attractive forces
between the molecules at the surface of
the adhesive and that of the surfaces to be
joined.
b. The smaller molecules provide better
adhesion.
c. The liquid adhesives do not require any
form of curing.
d. The curing temperature is always
maintained at over 500°C.](/v2/_next/image?url=https%3A%2F%2Fcontent.bartleby.com%2Fqna-images%2Fquestion%2F4245d8bb-0c17-4952-911e-6ab1637b5bce%2F86f5c632-624a-43ea-add5-fe38388dc0d0%2F3ejumjp_processed.jpeg&w=3840&q=75)
Transcribed Image Text:10)Which of the following statements are
correct regarding the Adhesive bonding
process?
a. Bonding relies on the attractive forces
between the molecules at the surface of
the adhesive and that of the surfaces to be
joined.
b. The smaller molecules provide better
adhesion.
c. The liquid adhesives do not require any
form of curing.
d. The curing temperature is always
maintained at over 500°C.
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