1. For the integrated circuit interconnect shown below:The copper thickness is 5000 A and conductivity is 5 x 107 mho/m, the tungsten thickness is 500 A andconductivity is 2x 107 mho/m,W= 0.25 umCu&rl = 6tX=200 AE2 = 42t2=5000 A For a 1cm length of interconnect:What is the resistance of the tungsten layer?a)b) What is the resistance of the copper layer?c) What is the total resistance of both layers?d) If a luA current is flowing through the interconnect, what is the current flowing through each of thetwo metal layers?e) Neglecting fringing capacitance, what is the capacitace between the top interconnect and the metallayer on the bottom?f) What is the magnitude of the charge on either top or bottom conductor if the potential diffrence is 1V?If the top conductor has a positive potential :g) What are the normal flux density vectors in both dielectric layers 1 and 2?h) What are the normal electric field vectors in 1 and 2?What are the normal polarization vectors in 1 and 2?i)j)What are the electric susceptibilities in 1 and 2?k) Draw the equivalent circuit for this interconnect system.1) What kind of filtering function does this circuit do?m) What is the time constant of this equivalent circuitn) How does this interconnect impact the maximum performance of high speed digital logic gates?

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1. For the integrated circuit interconnect shown below: The copper thickness is 5000 A and conductivity is 5 x 10° mho/m, the tungsten thickness is 500 A and conductivity is 2x 107 mho/m , w= 0.25 um Cu Erl = 6 (1 tH=200 A -S000 A

1. For the integrated circuit interconnect shown below: The copper thickness is 5000 A and conductivity is 5 x 10° mho/m, the tungsten thickness is 500 A and conductivity is 2x 107 mho/m , w= 0.25 um Cu Erl = 6 (1 tH=200 A -S000 A

Introductory Circuit Analysis (13th Edition)

13th Edition

ISBN:9780133923605

Author:Robert L. Boylestad

Publisher:Robert L. Boylestad

Chapter1: Introduction

Section: Chapter Questions

Problem 1P: Visit your local library (at school or home) and describe the extent to which it provides literature...

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Question

1. For the integrated circuit interconnect shown below:
The copper thickness is 5000 A and conductivity is 5 x 107 mho/m, the tungsten thickness is 500 A and
conductivity is 2x 107 mho/m,
W= 0.25 um
Cu
&rl = 6
tX=200 A
E2 = 4
2
t2=5000 A

For a 1cm length of interconnect:
What is the resistance of the tungsten layer?
a)
b) What is the resistance of the copper layer?
c) What is the total resistance of both layers?
d) If a luA current is flowing through the interconnect, what is the current flowing through each of the
two metal layers?
e) Neglecting fringing capacitance, what is the capacitace between the top interconnect and the metal
layer on the bottom?
f) What is the magnitude of the charge on either top or bottom conductor if the potential diffrence is 1V?
If the top conductor has a positive potential :
g) What are the normal flux density vectors in both dielectric layers 1 and 2?
h) What are the normal electric field vectors in 1 and 2?
What are the normal polarization vectors in 1 and 2?
i)
j)
What are the electric susceptibilities in 1 and 2?
k) Draw the equivalent circuit for this interconnect system.
1) What kind of filtering function does this circuit do?
m) What is the time constant of this equivalent circuit
n) How does this interconnect impact the maximum performance of high speed digital logic gates?

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