1. As shown, silicon for computer chips is grown in large cylinders called "boules" that are 300 mm in diameter and 2 m in length. The density of silicon is 2.33 g/cm. Silicon wafers for making integrated circuits ,are sliced from a 2.0-m boule and are typically 0.75 mm thick and 300 mm in diameter. Diamond blade 0.75 mm thickness Si boule 300 mm diameter Cut wafers 2 m a. How wafers can be cut from a many single boule? b. What is the mass of a silicon wafer?

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1. As shown, silicon for computer chips
is grown in large cylinders called
"boules" that are 300 mm in diameter
Diamond blade
0.75 mm
thickness
and 2 m in length. The density of
silicon is 2.33 g/cm. Silicon wafers
for making integrated circuits , are
sliced from a 2.0-m boule and are
Si boule
300 mm
diameter
typically 0.75 mm thick and 300 mm
in diameter.
a. How many wafers can be cut from a
single boule?
b. What is the mass of a silicon wafer?
Cut wafers
2 m
Transcribed Image Text:1. As shown, silicon for computer chips is grown in large cylinders called "boules" that are 300 mm in diameter Diamond blade 0.75 mm thickness and 2 m in length. The density of silicon is 2.33 g/cm. Silicon wafers for making integrated circuits , are sliced from a 2.0-m boule and are Si boule 300 mm diameter typically 0.75 mm thick and 300 mm in diameter. a. How many wafers can be cut from a single boule? b. What is the mass of a silicon wafer? Cut wafers 2 m
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