1. A wafer is randomly selected from a batch that is classified by contamination ane location. Location in Sputtering Tool Contamination Center Edge Total Low 514 68 582 High 112 246 358 Total 626 314

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Chapter1: Combinatorial Analysis
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How to solve question b, c, d
1. A wafer is randomly selected from a batch that is classified by contamination and
location.
Location in Sputtering Tool
Contamination
Center
Edge
Total
Low
514
68
582
High
112
246
358
Total
626
314
a. The probability that the wafer contains high level of contamination.
b. The probability that the wafer is in the center of sputtering tool.
c. The probability that the wafer is from the center of the sputtering tool and
contains high level of contamination.
d. The probability that the wafer is from the center of the sputtering tool or
contains high level of contamination.
Transcribed Image Text:1. A wafer is randomly selected from a batch that is classified by contamination and location. Location in Sputtering Tool Contamination Center Edge Total Low 514 68 582 High 112 246 358 Total 626 314 a. The probability that the wafer contains high level of contamination. b. The probability that the wafer is in the center of sputtering tool. c. The probability that the wafer is from the center of the sputtering tool and contains high level of contamination. d. The probability that the wafer is from the center of the sputtering tool or contains high level of contamination.
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